ORGANIZING COMMITTEES
Conference Committee
Prof. Chong Kok Keong Universiti Tunku Abdul Rahman, Malaysia Dr. Abdul Latif Bin Mohd Tobi, Universiti Tun Hussein Onn Malaysia, Malaysia Prof. Norhaliza Abdul Wahab, Universiti Teknologi Malaysia, Malaysia Prof. Keishi Matsuda, Matsuyama University, Japan Prof. Ikuo IHARA, Nagaoka University of Technology, Japan
Program Committee
Prof. Marcello De Falco, University "Campus Bio-Medico" of Rome, Italy Dr. Narottam Das, University of Southern Queensland, Australia Assoc. Prof. CHING YERN CHEE, University of Malaya, Malaysia Prof. Saidur Rahman, Sunway University, Malaysia Prof. Mohan Lal Kolhe, University of Agder, Norway Prof. Dr. Yasuto Hijikata,Saitama University, Japan Prof. Eckart H. Meiburg, University of California, Santa Barbara Prof. DAVID BASSIR,French University of Technology,France Prof. Volkan Kahya, Karadeniz Technical University, Turkey Prof. Ramesh T Subramaniam, Universiti Malaya (UM), Malaysia
International Technical Committee
Prof. Ir. Dr. Ts. Abdul Talib bin Din, Universiti Teknikal Malaysia Melaka, Malaysia Prof. Bhaskar Biswas, University of North Bengal, India Prof.Ir. Dr. Ts. Abdul Talib bin Din,Universiti Teknikal Malaysia Melaka,Malaysia Assoc. Prof. Karunesh Tiwari, Babu Banarasi Das University, India Assoc. Prof. Abhijit Yadav, Rajarshi Shahu Mahavidyalaya, Latur (Autonomous), India Assoc. Prof. Beauty Pandey, Woxsen University, India Asst. Prof. Dr. Daya Shankar, Woxsen University, India Dr. Lim Bee Ying, Universiti Malaysia Perlis, Malaysia Dr. Poushali Das, McMaster University, Canada Dr. Satya Prakash Pati, Kyushu University, Japan Dr. Surendra Kumar Yadav, Banaras Hindu University, India
Submission Portal
Mail Address: cemp@sub-paper.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists;
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- TEL:15799881881 (微信同号)
- QQ:2130572537
- E-mail:cemp@sub-paper.com
Important Dates
Submission Deadline:2025-01-09
Registration Deadline:2025-01-16
Conference Date:2025-01-26
Notification Date:About a week after the submission