About to CEMP 2025
The International Conference on Chemical Engineering and Materials Physics in 2025 is about to be held grandly. This conference is a grand event in the field of chemical engineering and materials physics, aimed at providing a high-end platform for global experts and scholars to exchange ideas, share research results, and explore future development directions. The conference will delve into the latest developments in chemical engineering, cutting-edge explorations in materials physics, and the intersection and integration between the two. It is expected that the attendees will include renowned scholars, researchers, business representatives, and technical experts from around the world. They will share the latest research achievements and technological progress through various forms such as keynote speeches, group discussions, and technology exhibitions. In the field of chemical engineering, the conference will focus on the latest developments in green chemistry, sustainable processes, and new reactors. In terms of material physics, we will explore the latest breakthroughs in cutting-edge fields such as the preparation and characterization of new materials, quantum materials, optoelectronic materials, and nanomaterials. In addition, the conference will pay special attention to the application of chemical engineering and materials physics in environmental protection, new energy development, intelligent manufacturing and other fields, and explore innovative technologies and solutions in these areas. I believe that the convening of this conference will further promote innovative development in the fields of chemical engineering and materials physics, facilitate global scientific and technological exchanges and cooperation, and contribute wisdom and strength to the sustainable development of human society. We sincerely invite global experts and scholars to actively participate and witness the convening of this grand event together.
Record
All full paper submissions to the CEMP 2025 could be written in English and will be sent to at least two reviewers and evaluated based on originality, technical or research content or depth, correctness, relevance to conference, contributions, and readability. All accepted papers of CEMP 2025 will be published in the conference proceedings, which will be submitted to EI Compendex, Scopus for indexing.
Submission Portal
Mail Address: cemp@sub-paper.com
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists;
- 罗老师
- TEL：15799881881 (微信同号)
- QQ：2130572537
- E-mail：cemp@sub-paper.com
Important Dates
Submission Deadline：2025-01-09
Registration Deadline：2025-01-16
Conference Date：2025-01-26
Notification Date：About a week after the submission
CALL FOR PAPERS
Chemical Engineering: Pharmaceutical Engineering Environmental Chemical Engineering Chemical process Pharmaceutical Engineering Organic chemical industry Electrochemical Engineering Polymer Engineering Biochemistry and Technology Paper and fiber engineering Food Science and Engineering Colloidal and Interface Chemistry Chemical Thermodynamics and Dynamics Electrochemical and Biological Sensors Nanomaterials and Nanoelectronics Waste management and environmental chemicals All oxide heterostructures and devices High performance computing in material design Chemical Process Systems and Information Engineering Material Physics: nuclear physics quantum mechanics Optoelectronic materials Optoelectronics Thermodynamics of Materials Atomic Physics solid-state physics Microelectronics materials Atomic Physics Solid state physics Structure and physical properties Semiconductor Physics Material preparation technology Fundamentals of Materials Engineering Electrical and Electronic Technology Material Physics and Structure Materials Physics and Chemistry Optoelectronic Technology and Its Applications Nanomaterials and Nanotechnology Condensed Matter Physics and New Materials Physics and Applied Physics
..... View more themes>>About Plagiarism Check
Crosscheck Powered by iThenticate will be used for plagiarism check. The amount of duplication from previously published content should be less than 20%; If the amount of duplication is 20% - 35%, modification maybe required; if the amount of duplication exceeds 35%, the article will be rejected. Please note that there will be no refund for no-shows.
Indexing Service
中文特别声明
出版社在论文出版前会对论文重复率进行检测，重复率大于20%的稿件将被拒绝出版；重复率不大于20%的稿件中，如有整段大面积的直接复制其他作者文章内容的情况，也会被拒绝出版。以上两种涉及抄袭的情况，一旦被出版社证实，文章将被拒绝出版，并且不退回任何会议注册费用。
Technical Sponsor
Submission Guidelines
Submit
Please submit the full text/abstract
of the paper to us through the elec
tronic submission system
Call for Reviewers
As a platform for global academic communication, the quality of conference publication has always an aspect attracting much of our attention. To ensure quality of our publication and to better serve the peers in academic circle, we now call for reviewers among professionals and experts of the world. Professionals and experts who hold PhD (doctoral) degree in the conference related areas are encouraged to join in us and together, we will work hard to become a world-class academic conference. Please send us your CV by email (cemp@sub-paper.com) if you are interested in it.
SCI JOURNAL
Contributors are encouraged to submit papers / abstracts to the conference. The organizing committee will select high-quality papers and recommend them to SCI/SSCI journals. For specific matters, please contact the person in charge of the conferrence.
Submission Guidelines
Delegates are encouraged to submit their papers/abstracts to the conference. Good quality papers will be selected by the organizing committee and Prof. Soteris Kalogirou, the editor in chief. After it, the authors will be invited to extent their papers/abstracts and submit them to cemp@sub-paper.com. The normal size of research papers is 4,000-6,000 words excluding abstract and references.